Technical Program Manager II (PCB Design)

Technical Program Manager
Location: Fully Remote - US Only
Competitive Pay: $90/Hr (W2)
Duration: 12-month contract (expected extension/conversion)
Schedule: 40 hrs/week (Mon–Fri)
Benefits: Medical, dental, vision, 401(k), paid vacation & sick leave
 

Job Description

Our client is building the next generation of AR wearable devices that will redefine how people connect, work, and experience the world. We are seeking an experienced TPM with background in Electrical Engineering to drive the design and development of advanced flexible and rigid printed circuit boards (PCBs) for compact wearable form factors.

This role will play a critical part in enabling cutting-edge features through innovative circuit board design and seamless integration of electrical components. The ideal candidate thrives in fast-paced hardware environments and has deep experience owning PCB development from concept through mass production.

Responsibilities

• Own end-to-end PCB development for AR wearable products, including schematics, layout, form factor development, fabrication, and vendor approval.
• Lead design releases for flex circuits and multi-layer boards (MLBs) from early architecture through production ramp.
• Partner cross-functionally with Electrical Engineering, Mechanical Engineering, Operations, and Supply Chain teams to ensure robust design integration.
• Drive SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds, optimizing for quality, yield, and schedule adherence.
• Collaborate closely with APAC contract manufacturers and flex vendors to ensure supplier readiness and manufacturing excellence.
• Proactively identify technical risks, manage schedules, and implement mitigation strategies throughout development cycles.
• Support integration of miniaturized electrical components into highly compact, performance-driven wearable designs.
• Accommodate cross-regional collaboration, including working outside standard hours as needed to support APAC partners.

Must-Have Skills

• 5+ years of experience in electrical design, PCB development, or hardware engineering.
• Proven ownership of flex and multi-layer PCB design releases through full product lifecycle (concept to production).
• Hands-on experience managing SMT and FATP builds, including yield and quality optimization.
• Direct experience working with APAC contract manufacturers and managing vendor relationships.
• Strong understanding of PCB fabrication processes, materials, and DFM best practices.

Nice-to-Have Skills

• Experience developing AR wearable devices or consumer wearable electronics.
• Expertise in small-component integration within ultra-compact form factors.
• Familiarity with advanced PCB technologies (HDI, rigid-flex, microvias, high-speed design considerations).
• Strong cross-functional communication and project management skills in high-volume consumer electronics environments.

Educational Background/Certifications Required

• Degree in Electrical Engineering or related field preferred, but not required.
• Relevant experience is more important than formal education.

Pursuant to the California Fair Chance Act, Los Angeles County Fair Chance Ordinance for Employers, Los Angeles Fair Chance Initiative for Hiring Ordinance, and San Francisco Fair Chance Ordinance, qualified applicants will be considered for assignment with arrest and conviction records. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness, meet client expectations, standards, and accompanying requirements, and safeguard business operations and company reputation.